This paper presents power management guidelines for PCI Express links on Intel-based Mobile platforms. It describes the mapping from platform sleeping states and device power states to link power states, including the procedure to support Mobile-specific S1/POS and CPU C3/C4 scenarios. Device and platform power saving opportunities are identified for each link power state. L1 entry policy is also recommended to optimize device power. Several power optimization techniques are described, including minimizing flow control updates and acknowledgement packets to improve bandwidth efficiency, and pipelining packets to increase opportunities for active state link power management. These power management guidelines enable architectural innovation to achieve power-optimized interconnect performance.

PCI Express Base Specification Revision 2.0 协议规范

PCI Express规范、协议介绍，最新版（V3.0）,设计PCIE板卡的时候找到的资料，有PCIE接口介绍、信号介绍以及电气特性介绍、以及PCIE板卡连接器规范介绍等。

electron vue3 ffmpeg 推流开发桌面应用 本项目实现以下几点功能： 1.html video 播放 .flv 格式 推流； 2.实现本地推流，或输入指定地址推流 3.本项目为electron开发项目 4.本项目采用vue3 typescript 开发; 5.可实现截屏指定区域录屏， 6.本项目已配置好打包相关服务，只需npm run win 可生成exe安装文件 本项目 已配置好相关推流低延时设置，如webtrc格式播放，可以在1.5s 左右电脑性能好会更低 使用方法， npm i 与 cd 到eleron 在npm i 两次安装

Microsoft Visual Studio 2008 Express with SP1 带 SP1 的 Visual Web Developer 2008 速成版,这个是我放在这里备份的，这些老东西很难找了。

1. INTRODUCTION............................................................................................................... 46 1.1. A THIRD GENERATION I/O INTERCONNECT ................................................................... 46 1.2. PCI EXPRESS LINK......................................................................................................... 49 1.3. PCI EXPRESS FABRIC TOPOLOGY .................................................................................. 50 1.3.1. Root Complex........................................................................................................ 50 1.3.2. Endpoints .............................................................................................................. 51 1.3.3. Switch .................................................................................................................... 54 1.3.4. Root Complex Event Collector .............................................................................. 55 1.3.5. PCI Express to PCI/PCI-X Bridge........................................................................ 55 1.4. PCI EXPRESS FABRIC TOPOLOGY CONFIGURATION ....................................................... 55 1.5. PCI EXPRESS LAYERING OVERVIEW.............................................................................. 56 1.5.1. Transaction Layer ................................................................................................. 57 1.5.2. Data Link Layer .................................................................................................... 57 1.5.3. Physical Layer ...................................................................................................... 58 1.5.4. Layer Functions and Services............................................................................... 58 TRANSACTION LAYER SPECIFICATION ................................................................. 62 2.1. TRANSACTION LAYER OVERVIEW.................................................................................. 62 2.1.1. Address Spaces, Transaction Types, and Usage................................................... 63 2.1.2. Packet Format Overview ...................................................................................... 65 2.2. TRANSACTION LAYER PROTOCOL - PACKET DEFINITION............................................... 67 2.2.1. Common Packet Header Fields ............................................................................ 67 2.2.2. TLPs with Data Payloads - Rules ......................................................................... 70 2.2.3. TLP Digest Rules .................................................................................................. 74 2.2.4. Routing and Addressing Rules .............................................................................. 74 2.2.5. First/Last DW Byte Enables Rules........................................................................ 78 2.2.6. Transaction Descriptor ......................................................................................... 81 2.2.7. Memory, I/O, and Configuration Request Rules................................................... 87 2.2.8. Message Request Rules ......................................................................................... 94 2.2.9. Completion Rules ................................................................................................ 115 2.2.10. TLP Prefix Rules ................................................................................................. 118 2.3. HANDLING OF RECEIVED TLPS.................................................................................... 123 2.3.1. Request Handling Rules...................................................................................... 126 2.3.2. Completion Handling Rules................................................................................ 138 2.4. TRANSACTION ORDERING ............................................................................................ 142 2.4.1. Transaction Ordering Rules ............................................................................... 142 ......

Nodejs_CMS_Tutorial:使用Nodejs，Express和Mongoose的内容管理系统

PCIe3.0协议规范原文件

'We have always recommended these books to our customers and even our own engineers for developing a better understanding of technologies and specifications. We find the latest PCI Express book from MindShare to have the same content and high quality as all the others.' --Nader Saleh, CEO/President, Catalyst Enterprises, Inc. PCI Express is the third-generation Peripheral Component Inter-connect technology for a wide range of systems and peripheral devices. Incorporating recent advances in high-speed, point-to-point interconnect

NVM Express and the PCI Express* SSD RevolutionSSDS003Danny Cobb, CTO Flash Memory Business Unit, EMC Amber Huffman, Sr. Principal Engineer, Intel2Agenda• NVM Express (NVMe) Overview• New NVMe Features in Enterprise & Client• Driver Ecosystem for NVMe• NVMe Interoperability and Plugfest Plans• EMC’s Perspective: NVMe Use Cases and Proof PointsThe PDF for this Session presentation is available from our Technical Session Catalog at the end of the day at:intel.com/go/idfsessions URL is on to