《基于Verilog-A的SAR ADC及其模数转换与混合信号IC设计教程与实战手册:含现成常用器件代码》,Verilog-A 学习资料 SAR ADC 模数转器 混合信号IC设计 模拟IC设计 包含现成常用的Verilog-A器件代码,可以直接拿来用 Verilog-A 一种使用 Verilog 的语法来描述模拟电路的行为 ,Verilog-A; SAR ADC; 模数转换器; 混合信号IC设计; 模拟IC设计; 器件代码,《Verilog-A教程:SAR ADC与混合信号IC设计模数转换模拟》
2025-05-09 16:20:07 661KB 哈希算法
1
模拟IC设计入门:SMIC 0.18um锁相环电路仿真实践与结果解析,锁定频率约400MHz环形VCO应用,模拟IC设计入门:SMIC 0.18um锁相环电路仿真与VCO环形结构探索,锁定频率约400M,模拟ic设计,smic0.18um的锁相环电路,较简单的结构,适合入门学习,可以直接仿真,输出结果较为理想,锁定频率在400M附近,内置环形的VCO。 相对简单的电路,入门学习用。 ,模拟IC设计; SMIC0.18um; 锁相环电路; 简单结构; 适合入门学习; 仿真; 锁定频率400M附近; 环形VCO。,入门学习:模拟IC设计之0.18um锁相环电路(400MHz附近)
2025-04-10 15:23:09 4.51MB kind
1
基于振荡器采样的真随机数发生器(模拟IC设计
2024-04-07 17:37:21 3.96MB 模拟IC设计
1
Table of Contents Foreword .................................................................................... xiii Acknowledgements .....................................................................xv 1 Introduction....................................................................................1 1.1 Goals of This Document................................................................................ 2 1.1.1 Assumptions ..................................................................................... 3 1.1.2 Definitions ........................................................................................ 3 1.1.3 Virtual Socket Interface Alliance ..................................................... 4 1.2 Design for Reuse: The Challenge.................................................................. 4 1.2.1 Design for Use.................................................................................. 5 1.2.2 Design for Reuse .............................................................................. 5 1.2.3 Fundamental Problems ..................................................................... 6 2 The System-on-a-Chip Design Process.........................................7 2.1 A Canonical SoC Design............................................................................... 7 2.2 System Design Flow...................................................................................... 8 2.2.1 Waterfall vs. Spiral ........................................................................... 9 2.2.2 Top-Down vs. Bottom-Up .............................................................. 11 2.2.3 Construct by Correction ................................................................. 13 2.3 The Specification Problem .......................................................................... 13 2.3.1 Specification Requirements ............................................................ 14 2.3.2 Types of Specifications................................................................... 14 12 Data and Project Management ...............................................205 12.1 Data Management...................................................................................... 205 12.1.1 Revision Control Systems ............................................................ 205 12.1.2 Bug Tracking ................................................................................ 207 12.1.3 Regression Testing........................................................................ 207 12.1.4 Managing Multiple Sites .............................................................. 208 12.1.5 Archiving ...................................................................................... 208 12.2 Project Management.................................................................................. 209 12.2.1 Development Process.................................................................... 209 12.2.2 Functional Specification ............................................................... 209 12.2.3 Project Plan................................................................................... 210 13 Implementing a Reuse Process ...............................................211 13.1 Key Steps in Implementing a Reuse Process............................................. 211 13.2 Dealing with Legacy Designs.................................................................... 212 13.2.1 Recapturing Intent ........................................................................ 213 13.2.2 Using the Design As-Is................................................................. 213 13.2.3 Retiming ....................................................................................... 213 13.2.4 Tools for Using Legacy Designs................................................... 214 13.2.5 Summary....................................................................................... 214 Glossary .....................................................................................215
2024-03-27 13:46:12 1.42MB 数字IC
1
文件中是《通信IC设计》下册的PDF,欢迎下载。。。。。。
2024-03-15 08:51:43 65.29MB
1
Genus的基本使用示例以及详细使用文档,易懂易学,入门快,
2024-02-27 11:14:43 80.25MB IC设计 genus
1
SynopsysDesign Compiler,是一个基于UNIX系统,通过命令行进行交互的综合工具,除了综合之外,它还含有一个静态时序分析引擎及FPGA和LTL(links-to-layout)的解决方案。我们就以下几个方面对DC做以介绍:
2024-01-12 16:54:01 950KB IC设计 synthesis工具 Design Compiler
1
专用IC芯片组(chipset),光学读取头(pickup)与主轴马达(spindle)是CD-ROM三大核心零组件。其中,IC芯片组的作用可以说相当于人体的心脏,它的表现如何很大程度上决定了光驱整体的运转效能。随着近年来微处理技术和芯片制造业的飞速发展,IC集成度年复一年保持了指数级增长。这完全验证了早年集成电路发明者戈登摩尔(前英特尔公司总裁)的预测。
2023-12-08 21:08:30 21KB
1
AG7220支持HDMI2.0协议,带宽为每通道6Gbps,可支持高达4K2K@60Hz分辨率的视频性能。AG7220可以支持无需外部电源的功能补给。与传统的无源电缆相比,有了AG7220,HDMI电缆制造商可提供更薄或更长的HDMI2.0电缆,具有同等的视频性能。 AG7120支持HDMI1.4 ,4K2K@30Hz分辨率的视频性能。 AG7120/AG7220两者共同点如下: 1.应用范围: HDMI/DVI电缆延长线; HDMI/DVI有源电缆组件; 投影仪;高清显示器 2.工艺和包装 QFN 24 4X4mm封装尺寸; 扩展商业温度范围(0°C至+70°C) AG7120|AG7220|HDMI信号放大器方案|HDMI线缆延长方案
2023-11-30 10:21:35 252KB diy制作 电路设计方案 电路方案
1
精通VerilogHDL:IC设计核心技术实例详解 -部分习题源码
2023-11-11 16:41:51 181KB VerilogHDL
1