Version: 1.2.0 (2020-08-03) Keil.STM32G4xx_DFP.1.2.0.pack Added devices: STM32G491xxxx, STM32G4A1xxxx and STM32G483xx series. STM32G474Px/STM32G484Px/STM32G473Px/STM32G483Px BGA121 variants. STM32G431MBTx, STM32G441MBTx variants. Updated STM32CubeG4 Firmware Package to V1.3.0. Updated svd files Fixed flash programming algorithm issue for the STM32G4xxxC devices to support both Dual/Single Bank configuration in STM32G4xx_256.FLM. Updated the Flash category 3 (512kB) with one FLM that supports the D/S Bank config. FrameworkCubeMX_gpdsc.ftl: Added support for Timebase Source TIMx Updated example: Terminating app_main thread with osThreadExit() to avoid endless loop

Version: 2.5.0 (2020-03-23) Keil.STM32H7xx_DFP.2.5.0.pack Board Support: Added STM32H7B3I_EVAL board support. Blinky example Flash Programming: Updated the internal Flash programming algorithm for STM32H7xxxG devices with 1MB flash size. Updated the external FMC-NOR programming algorithm for both STM32H743I Eval Rev B01 (2015) and B03 (2018). Added support for the external QSPI programming algorithm for the STM32H747I Disco board. Added support for the external MMC programming algorithm for the STM32H750B-Disco board.

Version: 2.7.0 (2020-10-30) Keil.STM32H7xx_DFP.2.7.0.pack Devices Support: Added device description for STM32H735VGHx, STM32H725VGHx and STM32H725VEHx. Updated a subset of SVD files (STM32H723, STM32H73x, STM32H7A3x, STM32H7B3x). Updated Reference Manual for STM32H7A3/B3 and STM32H7B0.

实现通过uart_rx接收PC机发送的数据并将其存储到双口RAM中，然后通过uart_tx发送从双口RAM中读取的数据，显示在PC机中。

5.08mm HT-5.08弯针立式贴片插座2P-12P板级PCB封装库（Protel99封装库），10个PCB封装文件，.LIB后缀protel库文件。

2.54mm简牛立式直插插座4P-50P 板级PCB封装库（Protel99封装库），32个PCB封装文件，.LIB后缀protel库文件。

光互联技术相对于传统的电互联技术具有高速、高带宽、低功耗、低损耗和抗电磁干扰等优势，在高性能计算机、高速交换系统及波分复用（WDM）终端等方向都具有巨大的应用前景。板级电路在电子系统中占据主导地位，就国内外板级波导光互联技术研究现状进行了阐述与分析，并对光电印制电路板（EOPCB）国内外发展水平进行了对比，为我国在该技术领域未来的主要研究方向及重点提供参考。最后对板级光电互联技术的发展趋势进行了展望。

基于CST和ADS的PCB板级射频链路仿真。本仿真流程属于傻瓜式，无需自己做多余的设置。在确认板材特性的情况下可以做到仿真smith原图位置非常准。但是插损至今无法很好的仿真，毕竟厂家也可能不知道这个材料的具体参数。