18位电流输出DAC模块LTC2756评估板AD设计硬件原理图pcb+AD集成封装库+BOM文件,2层板设计，Altium Designer 设计的工程文件，包括完整的原理图及PCB文件，可以用Altium(AD)软件打开或修改，已制样板测试验证，可作为你产品设计的参考。集成封器件型号列表： Library Component Count : 14 Name Description ---------------------------------------------------------------------------------------------------- AD8397ARDZ Imported Capacitor CAP.,1uF,X74,10V,10%,1206 Header 10X1 2.54 Header, 100mil, 2x1_1Header, 100mil, 2x1, Tin plated, TH Header, 100mil, 3x1 Header, 100mil, 3x1, Tin plated, TH KJDZ-2 快接端子 LT1012 LT1012 LT1360 LT1360 LTC2054_1 LTC2054 LTC2756AIG LTC2756AIG LTC6244 Imported LTC6655 LTC6655 Resistor RES.,1K OHMS,5%,1/16W,0603 SMA-KE CONNECTOR, SHEILDED, END LAUNCH JACK, GOLD PLATED, FOR 0.062 PCB, EDGE MOUNTED

Xilinx FPGA Zynq-7000全系列（AD集成封装库）,IntLib后缀文件，带3D视图，拆分后文件为PcbLib+SchLib格式，Altium Designer原理图库+PCB封装库，集成封装型号列表： Library Component Count : 45 Name Description ---------------------------------------------------------------------------------------------------- XC7Z010-1CLG400C 667 MHz Zynq?7000 AP SoC, 130 PS I/O, 100 FPGA I/O, 400-Ball BGA, Speed Grade 1, Commercial Grade, Pb-Free XC7Z010-1CLG400I 667 MHz Zynq?7000 AP SoC, 130 PS I/O, 100 FPGA I/O, 400-Ball BGA, Speed Grade 1, Industrial Grade, Pb-Free XC7Z010-2CLG400E 733 MHz Zynq?7000 AP SoC, 130 PS I/O, 100 FPGA I/O, 400-Ball BGA, Speed Grade 2, Extended Grade, Pb-Free XC7Z010-2CLG400I 733 MHz Zynq?7000 AP SoC, 130 PS I/O, 100 FPGA I/O, 400-Ball BGA, Speed Grade 2, Industrial Grade, Pb-Free XC7Z010-3CLG400E 800 MHz Zynq?7000 AP SoC, 130 PS I/O, 100 FPGA I/O, 400-Ball BGA, Speed Grade 3, Extended Grade, Pb-Free XC7Z020-1CLG400C 667 MHz Zynq?7000 AP SoC, 130 PS I/O, 125 FPGA I/O, 400-Ball BGA, Speed Grade 1, Commercial Grade, Pb-Free XC7Z020-1CLG400I 667 MHz Zynq?7000 AP SoC, 130 PS I/O, 125 FPGA I/O, 400-Ball BGA, Speed Grade 1, Industrial Grade, Pb-Free XC7Z020-1CLG484C 667 MHz Zynq?7000 AP SoC, 130 PS I/O, 200 FPGA I/O, 484-Ball BGA, Speed Grade 1, Commercial Grade, Pb-Free XC7Z020-1CLG484I 667 MHz Zynq?7000 AP SoC, 130 PS I/O, 200 FPGA I/O, 484-Ball BGA, Speed Grade 1, Industrial Grade, Pb-Free XC7Z020-2CLG400E 733 MHz Zynq?7000 AP SoC, 130 PS I/O, 125 FPGA I/O, 400-Ball BGA, Speed Grade 2, Extended Grade, Pb-Free XC7Z020-2CLG400I 733 MHz Zynq?7000 AP SoC, 130 PS I/O, 125 FPGA I/O, 400-Ball BGA, Speed Grade 2, Industrial Grade, Pb-Free XC7Z020-2CLG484E 733 MHz Zynq?7000 AP SoC, 130 PS I/O, 200 FPGA I/O, 484-Ball BGA, Speed Grade 2, Extended Grade, Pb-Free XC7Z020-2CLG484I 733 MHz Zynq?7000 AP SoC, 130 PS I/O, 200 FPGA I/O, 484-Ball BGA, Speed Grade 2, Industrial Grade, Pb-Free XC7Z020-3CLG400E 800 MHz Zynq?7000 AP SoC, 130 PS I/O, 125 FPGA I/O, 400-Ball BG

AR8031-AL1B QFN48+RJ45,HR862138H,千兆,带灯,带变压器 AD集成封装库，.IntLib后缀文件，拆分后文件为PcbLib+SchLib格式，Altium Designer原理图库+PCB封装库，已在项目中验证使用，可以直接应用到你的项目开发。集成库器件列表: Library Component Count : 62 Name Description ---------------------------------------------------------------------------------------------------- 74AUP1G00GW 74LVC244AD 74LVC2G34GW 9DML0441AKILFT AR8031 BAT54C Battery Bead CHK COME_104X 74F14 74HC14 Cap Cap Pol1 Crystals_POWER D Zener DB9_M Connector DS110DF111 FDMS6681Z Fuse GPS_RF HR862138H 74F14 74HC14 Header 2 Header 3 Header 5X2 ICS8304AMI Inductor Iron KEY_2P_DIP LED LED3_UG_MR_DY M.2_B-Key M.2_E-Key MAX3232 MAX811T MHOLE MHOLE-2 MHOLE_LOGO MHOLE_MARK MICRO_SIM_ZTS 自弹式，带卡检测 MP1482(2307) NPN PUSB3AB6 PWR2.5 RJ45_Gigabit RT9013 RX8010SJ Res3 SIP_3P SRV25-4LC SW_2 Socket TFCARD TPS2051 TVS_D TVS_LC U77-A1613-1001 UAB3.0 FM UE76-A20-3000T mini PCIE mini PCIE_LOCK

mini PCIE 接口AD集成封装库，.IntLib后缀文件，拆分后文件为PcbLib+SchLib格式，Altium Designer原理图库+PCB封装库，已在项目中验证使用，可以直接应用到你的项目开发。集成库器件列表: Library Component Count : 62 Name Description ---------------------------------------------------------------------------------------------------- 74AUP1G00GW 74LVC244AD 74LVC2G34GW 9DML0441AKILFT AR8031 BAT54C Battery Bead CHK COME_104X 74F14 74HC14 Cap Cap Pol1 Crystals_POWER D Zener DB9_M Connector DS110DF111 FDMS6681Z Fuse GPS_RF HR862138H 74F14 74HC14 Header 2 Header 3 Header 5X2 ICS8304AMI Inductor Iron KEY_2P_DIP LED LED3_UG_MR_DY M.2_B-Key M.2_E-Key MAX3232 MAX811T MHOLE MHOLE-2 MHOLE_LOGO MHOLE_MARK MICRO_SIM_ZTS 自弹式，带卡检测 MP1482(2307) NPN PUSB3AB6 PWR2.5 RJ45_Gigabit RT9013 RX8010SJ Res3 SIP_3P SRV25-4LC SW_2 Socket TFCARD TPS2051 TVS_D TVS_LC U77-A1613-1001 UAB3.0 FM UE76-A20-3000T mini PCIE mini PCIE_LOCK

TF卡micro sim卡AD集成封装库，.IntLib后缀文件，拆分后文件为PcbLib+SchLib格式，Altium Designer原理图库+PCB封装库，已在项目中验证使用，可以直接应用到你的项目开发。集成库器件列表: Library Component Count : 62 Name Description ---------------------------------------------------------------------------------------------------- 74AUP1G00GW 74LVC244AD 74LVC2G34GW 9DML0441AKILFT AR8031 BAT54C Battery Bead CHK COME_104X 74F14 74HC14 Cap Cap Pol1 Crystals_POWER D Zener DB9_M Connector DS110DF111 FDMS6681Z Fuse GPS_RF HR862138H 74F14 74HC14 Header 2 Header 3 Header 5X2 ICS8304AMI Inductor Iron KEY_2P_DIP LED LED3_UG_MR_DY M.2_B-Key M.2_E-Key MAX3232 MAX811T MHOLE MHOLE-2 MHOLE_LOGO MHOLE_MARK MICRO_SIM_ZTS 自弹式，带卡检测 MP1482(2307) NPN PUSB3AB6 PWR2.5 RJ45_Gigabit RT9013 RX8010SJ Res3 SIP_3P SRV25-4LC SW_2 Socket TFCARD TPS2051 TVS_D TVS_LC U77-A1613-1001 UAB3.0 FM UE76-A20-3000T mini PCIE mini PCIE_LOCK

USB3.0,竖卧,直插+DB9,公座 AD集成封装文件,.IntLib后缀文件，拆分后文件为PcbLib+SchLib格式，Altium Designer原理图库+PCB封装库，已在项目中验证使用，可以直接应用到你的项目开发。集成库器件列表: Library Component Count : 62 Name Description ---------------------------------------------------------------------------------------------------- 74AUP1G00GW 74LVC244AD 74LVC2G34GW 9DML0441AKILFT AR8031 BAT54C Battery Bead CHK COME_104X 74F14 74HC14 Cap Cap Pol1 Crystals_POWER D Zener DB9_M Connector DS110DF111 FDMS6681Z Fuse GPS_RF HR862138H 74F14 74HC14 Header 2 Header 3 Header 5X2 ICS8304AMI Inductor Iron KEY_2P_DIP LED LED3_UG_MR_DY M.2_B-Key M.2_E-Key MAX3232 MAX811T MHOLE MHOLE-2 MHOLE_LOGO MHOLE_MARK MICRO_SIM_ZTS 自弹式，带卡检测 MP1482(2307) NPN PUSB3AB6 PWR2.5 RJ45_Gigabit RT9013 RX8010SJ Res3 SIP_3P SRV25-4LC SW_2 Socket TFCARD TPS2051 TVS_D TVS_LC U77-A1613-1001 UAB3.0 FM UE76-A20-3000T mini PCIE mini PCIE_LOCK

WIFI天线封装（AD集成封装库）

VL812 USB3.0 hub 1分4 PDF原理图PCB+AD集成封装库（USB3.0扁口座+MICRO USB3.0座封装）， ALTIUM工程转的PDF原理图PCB文件+AD集成封装库，已在项目中验证，可以做为你的设计参考。集成封装库器件列表： Library Component Count : 19 Name Description ---------------------------------------------------------------------------------------------------- APM2301AAC-TR_0 BAT54C/SOT_0 BEAD C CE DCJack-IDJ-D22-6T_0 FUSE G547E2P11U INDUCTOR LED-LT8A23-51-UR96-T5 MX25L512COI-12G R SMD_CRYSTAL_0 SS22_0 TestPoint TitleBlock0 USB-UEA11123-4HK1-4H USB-UEB11123-2JK1-4H_0 VT3470 HUB QFN76_V1_4.02

VL812 USB3.0 hub 参考设计 ALTIUM硬件设计原理图+PCB+AD集成封装库文件，2层板设计，大小为78X42mm,Altium Designer 设计的工程文件，包括原理图及PCB文件，可以用Altium(AD)软件打开或修改，可作为你产品设计的参考。集成封器件型号列表： Library Component Count : 19 Name Description ---------------------------------------------------------------------------------------------------- APM2301AAC-TR_0 BAT54C/SOT_0 BEAD C CE DCJack-IDJ-D22-6T_0 FUSE G547E2P11U INDUCTOR LED-LT8A23-51-UR96-T5 MX25L512COI-12G R SMD_CRYSTAL_0 SS22_0 TestPoint TitleBlock0 USB-UEA11123-4HK1-4H USB-UEB11123-2JK1-4H_0 VT3470 HUB QFN76_V1_4.02

MAX10FPGA 应用产品开发板AD集成封装库文件，MAX10FPGA 10M08SC + TPS5430+AD7367BRUZ +DAC7731E+DB25集成封装库,.IntLib后缀文件，拆分后文件为PcbLib+SchLib格式，Altium Designer原理图库+PCB封装库，已在项目中验证使用，可以直接应用到你的项目开发。 集成库器件型号列表： Library Component Count : 29 Name Description ---------------------------------------------------------------------------------------------------- 10M08SC U169 2N7002 P-Channel Power MOSFET 74LVC1G125 Bus buffer/line driver; 3-state 74LVC4245 Octal Bus Transceiver and 3.3-V to 5-V Shifter with 3-State Outputs ACTIVE_OSC AD7367BRUZ Dual 12-Bit/14-Bit, AD CAP C 0.1uF X7R 50V 10% 0603 CAP TANT 表贴铝电解电容220uF 35V 8x10.2mm ±20％ CON6 2.5mm间距，单排，6P针，直座 D Zener 表贴肖特基二极管 40V 3.0A SMB DAC7731 DB25 DB25(孔) 母头 90度弯脚插座 DS26C32 HEADER 8X2 Header 13X2 Header, 13-Pin, Dual row Header 5 Header, 5-Pin Header 7 Header, 7-Pin Header 8 Header, 8-Pin INDUCTOR 绕组/STD· 磁屏蔽 KA79M12R LED LED红色(0603) MARK Marking Point MAX3232 MAX3232EUE+（TSSOP16） Resistance R 91K 1% 0603 1/10W SMBJ13CA 双向TVS SPX1117M3 LDO 800mA 1.8V电压输出 TLP291 TP test point TPS5430 5-A，宽压输入，降压型IC，SO8