Version: 2.6.0 (2021-07-30) Keil.STM32L4xx_DFP.2.6.0.pack Updated Pack to STM32Cube_FW_L4 Firmware Package version V1.17.0 Package Description: Added global define USE_FULL_LL_DRIVER to component ::Device:STM32Cube LL:Common. Added debugProbe board description. Device Support: Updated SVD files and documentation. Reworked device RAM size. Added missing devices: STM32L451CETx, STM32L452CETx, STM32L462CETx, STM32L4Q5CGTxP, STM32L4Q5CGUxP, STM32L4Q5VGTxP, STM32L4Q5QGIxP, STM32L4Q5ZGTxP, STM32L4Q5AGIxP, STM32L4Q5RGTxP. Removed devices: STM32L451RCYx, STM32L452RCYx, STM32L485xx. Updated dbgconf files - Add missing variable DoOptionByteLoading. CMSIS Flash Algorithm: Added algorithm for STM32L4RxxG devices. Updated flash algorithms: STM32L4Rx_2048_Dual, STM32L4P5xx_1M, STM32L4P5xx_512: Added empty check, disable interrupts while programming, fix programming while IWDG in HW mode. Fixed last word programming. CMSIS-Driver: USBH: Fixed port resume occasionally getting stuck in resume signaling. Added compile time configuration for reducing Bulk IN NAK rate. SPI: Updated Control function to: Set SPI bus speed only for master mode and disable DMA before reconfigure DMA Updated SPI_GetStatus function with correct error code Updated SPI_GetDataCount function when SPI is not initialized Board Examples: Updated Assembler option to armclang(Auto Select). Updated config files to CMSIS 5.8.0 and MDK-Middleware 7.13.0.

Version: 1.1.0 (2021-07-23) Keil.STM32U5xx_DFP.1.1.0.pack Updated STM32Cube Firmware U5 library to version V1.0.0 First official release of HAL and LL drivers for STM32U575xx/STM32U585xx devices

板级热分析模块，旧称BetaSoft。     HyperLynx Thermal软件主要用于分析处于设计阶段的电路板和电子元器件的热特性，消除这些产品的耗时原型再设计。32位的程序适于Windows操作系统。HyperLynx Thermal软件在分析产品的温度时具有高精度、快速和界面灵活友好的特点，因而独具优势。同时，HyperLynx Thermal软件与大多数的ECAD（目前包含IDF文件格式的MCAD）软件以及可靠性软件都具有良好的接口。该软件由美国 Dynamic Soft Analysis, Inc公司开发，并在过去12年中，一直在热分析软件领域独领风骚。美国Dynamic S

《Android板级支持与硬件相关子系统》

Version: 1.0.3 (2018-04-28) GigaDevice.GD32E10x_DFP.1.0.3.pack Download update GD32E10x firmware .

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