板级热分析模块，旧称BetaSoft。     HyperLynx Thermal软件主要用于分析处于设计阶段的电路板和电子元器件的热特性，消除这些产品的耗时原型再设计。32位的程序适于Windows操作系统。HyperLynx Thermal软件在分析产品的温度时具有高精度、快速和界面灵活友好的特点，因而独具优势。同时，HyperLynx Thermal软件与大多数的ECAD（目前包含IDF文件格式的MCAD）软件以及可靠性软件都具有良好的接口。该软件由美国 Dynamic Soft Analysis, Inc公司开发，并在过去12年中，一直在热分析软件领域独领风骚。美国Dynamic S

《Android板级支持与硬件相关子系统》

Version: 1.0.3 (2018-04-28) GigaDevice.GD32E10x_DFP.1.0.3.pack Download update GD32E10x firmware .

Version: 2.0.2 (2020-07-23) GigaDevice.GD32F10x_DFP.2.0.2.pack Download update pdsc file for GD32F10x.

Version: 3.2.0 (2019-10-30) GigaDevice.GD32F1x0_DFP.3.2.0.pack Download update firmware.

Version: 2.1.0 (2018-11-02) GigaDevice.GD32F20x_DFP.2.1.0.pack Download update firmware of GD32F20x Device Family Pack.

Version: 2.0.0 (2019-03-11) GigaDevice.GD32F30x_DFP.2.0.0.pack update svd file. Version: 1.1.0 (2018-12-12) GigaDevice.GD32F30x_DFP.1.1.0.pack update firmware description.

Version: 2.0.0 (2019-06-01) GigaDevice.GD32F3x0_DFP.2.0.0.pack update firmware. Version: 1.0.1 (2018-11-11) GigaDevice.GD32F3x0_DFP.1.0.1.pack update firmware.

Version: 2.0.0 (2019-03-11) GigaDevice.GD32F4xx_DFP.2.0.0.pack Update firmware. Version: 1.0.4 (2018-11-11) GigaDevice.GD32F4xx_DFP.1.0.4.pack Update firmware.

Version: 1.3.0 (2021-03-24) Keil.STM32G4xx_DFP.1.3.0.pack Download CMSIS Device Support: Updated STM32Cube Firmware G4 library to version V1.4.0. Updated SVD files. Updated documentation. CMSIS Flash Algorithm: Adding support to the QSPI external Loader for the STM32G474E-EVAL. Adding internal flash algorithm support for 128k dual bank devices. Fixing internal flash last word programming. Fixing internal flash extra sector erasing on dual bank mode for dual bank config devices. Added global define USE_HAL_DRIVER and USE_FULL_LL_DRIVER to the component ::Device:STM32Cube Framework:STM32CubeMX. Added debugProbe to board description.