Version: 2.0.0 (2019-03-11) GigaDevice.GD32F4xx_DFP.2.0.0.pack Update firmware. Version: 1.0.4 (2018-11-11) GigaDevice.GD32F4xx_DFP.1.0.4.pack Update firmware.

Version: 1.3.0 (2021-03-24) Keil.STM32G4xx_DFP.1.3.0.pack Download CMSIS Device Support: Updated STM32Cube Firmware G4 library to version V1.4.0. Updated SVD files. Updated documentation. CMSIS Flash Algorithm: Adding support to the QSPI external Loader for the STM32G474E-EVAL. Adding internal flash algorithm support for 128k dual bank devices. Fixing internal flash last word programming. Fixing internal flash extra sector erasing on dual bank mode for dual bank config devices. Added global define USE_HAL_DRIVER and USE_FULL_LL_DRIVER to the component ::Device:STM32Cube Framework:STM32CubeMX. Added debugProbe to board description.

Version: 1.3.0 (2020-06-24) Keil.STM32MP1xx_DFP.1.3.0.pack Added additional devices for STM32MP157 sub family. Added devices for the STM32MP151 and STM32MP153 sub families. Version: 1.2.0 (2020-02-11) Keil.STM32MP1xx_DFP.1.2.0.pack Removed production.config file from startup component and updated shell scripts accordingly. Updated STM32CubeMP1 Firmware Package. Updated examples: Terminating app_main thread with osThreadExit() to avoid endless loop

Version: 1.2.0 (2021-04-20) Keil.STM32WBxx_DFP.1.2.0.pack Updated STM32Cube_FW_WB Firmware Package to version V1.11.1 (HAL Drivers V1.8.0). Device Support: Added support for STM32WB15x/WB10x/WB5MMG devices. Fixed lastword programming, emptycheck, masserase when ESE=1 + clean flashloader project. Updated SVD files. Updated documentation. CMSIS-Driver: Added global define USE_HAL_DRIVER to the component ::Device:STM32Cube HAL:Common Added global define USE_FULL_LL_DRIVER to the component ::Device:STM32Cube LL:Common Boards: Updated NUCLEO-WB55 board description. Examples: Updated FrameworkCubeMX.gpdsc (Removed non-existent include path)

Version: 1.1.0 (2020-12-08) Keil.STM32WLxx_DFP.1.1.0.pack Device Support: Aligned devices with CubeMX DB (V6.1.0). Updated Pack to STM32CubeWL Firmware Package version V1.0.0 (using HAL Drivers V1.0.0.). Added Cube HAL support. Added CubeMX support for single core devices. Note: Projects for dual core devices need to be initiated from within STM32CubeMX generating the uVision projects. Updated SVD files. Updated documentation. Updated flash programming algorithms.

本文描述了硬件性能测试的一些方法，包含了各种测试技术，有对于了解板级测试

通过小梅哥AC620实验开发板和H6221红外装置解码接收到的红外波形。本资源包含实验所需的源代码，仿真以及顶层验证模块

完整英文电子版 JEDEC JESD22-B111A：2016 Board Level Drop Test Method of Components for Handheld Electronic Products(手持式电子产品元件的板级跌落测试方法)。 板级跌落测试方法旨在评估和比较在加速测试环境中用于手持电子产品应用的表面安装电子元件的跌落性能，在加速测试环境中，电路板的过度弯曲会导致产品故障。 本文的目的是标准化测试板和测试方法，以提供可重复评估的表面安装组件的跌落测试性能，同时复制在产品级测试期间通常观察到的故障模式。 这并不意味着要取代任何用于验证特定手持式电子产品所需的系统级跌落测试，也不意味着要涵盖模拟电子部件或PCB组件的运输和搬运相关冲击所需的跌落测试。

完整英文电子版JESD22-B113B：2018 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products - 用于手持电子产品的SMT IC的互连可靠性表征的板级循环弯曲测试方法。 板级循环弯曲测试方法旨在评估和比较SMT IC在手持电子产品应用的加速测试环境中的性能。 目的是使测试方法标准化，以提供SMT IC的可再现性能评估，同时复制在产品级测试期间通常观察到的故障模式。

修改自OpenCores的黑白棋游戏代码。采用VGA输出显示，PS2键盘（W、A、S、D、回车）输入控制，实现AI，LED灯指示是否游戏结束，VGA显示频率25MHz，系统频率50MHz，经过Cyclone IV芯片EP4CE115F29C7N的板级调试，实现全部功能，文件夹下有rtl源代码，管脚定义pin文件，和可以直接进行JTAG烧写和E2PROM烧写的pof和sof文件，具体说明文档详见http://www.openhw.org/lvlv2011/blog/11-11/235323_9a612.html