GB/T 14950-2009
你懂的！！~
标准编号：GB/T 14950-2009
标准名称：摄影测量与遥感术语
英文名称：Terms of photogrammetry and remote sensing
起草单位：国家测绘局测绘标准化研究所
归口单位：全国地理信息标准化技术委员会
代替标准：GB/T 14950-1994
发布日期：2009-02-06
实施日期：2009-06-01
标准格式：PDF
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2.69MB
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电子元件封装术语大全+电子元器件综合知识大全：
电子元件封装术语大全
目录
1、BGA(ball grid array).............................................................................................................3 2、BQFP(quad flat package with bumper)...............................................................................3 3、碰焊 PGA(butt joint pin grid array) 表面贴装型 PGA 的别称(见表面贴装型 PGA)。...3 4、C-(ceramic)..........................................................................................................................3 5、Cerdip..................................................................................................................................3 6、Cerquad...............................................................................................................................4 7、CLCC(ceramic leaded chip carrier) ......................................................................................4 8、COB(chip on board).............................................................................................................4 9、DFP(dual flat package) ........................................................................................................4
10、DIC(dual in-line ceramic package).....................................................................................4
11、DIL(dual in-line).................................................................................................................5
12、DIP(dual in-line package)...................................................................................................5
13、DSO(dual small out-lint)....................................................................................................5
14、DICP(dual tape carrier package)........................................................................................5
15、DIP(dual tape carrier package)..........................................................................................5
16、FP(flat package)...........................................................
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.NET小型证券术语解释及翻译系统的ASP毕业设计(源代码+论文).zip
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3.43MB
半导体与封装专业英语常用术语，可搜索查询
e.g.
Batch Manufacturing/批量制造：以群组、大量的方式制造，完成的所有组件皆
具有一致性。
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